Pittsburgh-based NovoLINC, a startup in advanced thermal interface materials, recently launched a product engineered to manage the extreme heat generated by next-generation AI accelerator chips.
The product, MaxLINC, has industry-leading thermal resistance and more than 20 percent cooling energy savings versus current products.
MaxLINC is designed to address the performance bottleneck caused by the thermal interface between semiconductor devices and advanced cooling systems. It can be used across multiple thermal interfaces and accommodates device and package warpage as high as 350 micrometer.
The combination of ultra-low thermal resistance, high-heat-flux capability, mechanical compliance, application flexibility, and warpage accommodation addresses the requirements of next-generation semiconductor thermal roadmaps. It also addresses the industry’s needs as transitions from air cooling toward direct liquid cooling and other advanced cooling architectures.
“Heat is quickly becoming the limiting factor in AI computing,” Dr. Ning Li, NovoLINC co-founder and CEO, said. “Every bit of thermal resistance we remove turns directly into headroom that can be re-directed to higher chip performance, more compute, less wasted energy, and lower operating costs for the data center operator.”
The company is expanding its operations into a new facility in Sharpsburg that will provide increased manufacturing scale-up capacity, product qualification and testing, and continued research and development.