Coherent Corp., based in Pittsburgh, signed an agreement with Mitsubishi Electric to collaborate on a program to scale manufacturing of silicon carbide, or SiC, power electronics.
SiC power devices have lower energy losses, higher operating temperatures, and higher switching speeds compared with power devices based on silicon. One of the factors that is driving the growth of SiC power devices is electric vehicles.
To meet growing demand, Tokyo-based Mitsubishi Electric will invest approximately 100 billion yen to construct a new plant for SiC power devices, based on a 200 mm technology platform, and enhance related production facilities.
As part of the memorandum of understanding (MOU), Coherent will develop a supply of 200 mm n-type 4H SiC substrates for Mitsubishi Electric’s future SiC power devices manufactured at the new facility.
Coherent has decades of experience in the development of SiC materials, demonstrating the world’s first 200 mm conductive substrates in 2015. In 2019, Coherent began to supply 200 mm SiC substrates as part of a four-year program funded by the European Commission.
“We are excited to build on our relationship with Mitsubishi Electric, a pioneer in SiC power devices and a global market leader in SiC power modules for high-speed trains, including the famous Shinkansen in Japan,” Sohail Khan, executive vice president, new ventures and wide-bandgap electronics technologies at Coherent, said. “We have a long track record of supplying SiC substrates to Mitsubishi Electric and are looking forward to expanding our relationship with them to scale their new 200 mm SiC platform.”
Mitsubishi Electric has led the SiC power module markets for high-speed trains, high-voltage industrial applications, and home appliances. Also, Mitsubishi Electric launched the world’s first SiC power modules for air conditioners in 2010 and became the first supplier of a full SiC power module for Shinkansen high-speed trains in 2015.
“Coherent has been for many years a reliable supplier of high-quality 150 mm SiC wafer substrates to Mitsubishi Electric. We are delighted to enter into this close partnership with Coherent to scale our respective SiC manufacturing platforms to 200 mm,” Masayoshi Takemi, executive officer, group president, semiconductor and device at Mitsubishi Electric, said.