Advanced Semiconductor Engineering (ASE), a California-based semiconductor packaging and test services provider, recently created state-of-the-art microchips using the ANSYS Customization Toolkit (ACT) solution developed by Pittsburgh-based ANSYS, an engineering simulation company.
Engineers create models in the integrated circuit (IC) manufacturing process to boost product performance and identify design problems. ASE’s ACT extension significantly reduces human error in computer errors by converting manual analyses into an automatic search process.
It allows engineers to create precise models quickly, identify problematic parts, and develop a solution. It also reduces development time by 30 percent.
“ASE is committed to constructing a complete solution for developing IC packaging technology, strengthening design and high-yield manufacturing,” C.P. Hung, ASE Group’s vice president of corporate research and development, said. “We are very pleased to have a long-term collaboration with ANSYS. The automated analysis technology developed by ACT is the first step in developing future intelligent analysis and design, converting converse complex manual analysis into an automatic search process for potentially critical areas such as cracking, interface delamination, and more. ACT will bring more opportunities for advanced packaging and system-level design to the market and accelerate customer product launches.”
ASE provides the semiconductor market with IC packaging, front-end engineering, wafer probing, and interconnect materials design and production.